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HSP061-2 Datenblatt(PDF) 5 Page - STMicroelectronics |
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HSP061-2 Datenblatt(HTML) 5 Page - STMicroelectronics |
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5 / 12 page ![]() DocID022777 Rev 2 5/12 HSP061-2 Package information 12 3 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. SOT-666 dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 0.27 0.34 0.007 0.011 0.013 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 e 0.50 0.020 L1 0.19 0.007 L2 0.10 0.30 0.004 0.012 L3 0.10 0.004 Figure 11. Footprint recommendations dimensions in mm (inches) Figure 12. Marking for SOT-666 D b L3 L1 e b1 E1 L2 E A A3 0.50 (0.019) 2.60 (0.01) 0.62 (0.024) 0.30 (0.012) 0.99 (0.039) R |
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