Characteristics

STPS3L60-Y

4/7

Doc ID 17537 Rev 1

Figure 11.

Thermal resistance junction to ambient versus copper surface under each lead

Figure 7.

Reverse leakage current versus

reverse voltage applied (typical

values)

Figure 8.

Junction capacitance versus

reverse voltage applied (typical

values)

0

5

10 15 20 25 30 35 40 45 50 55 60

1E-3

1E-2

1E-1

1E+0

1E+1

5E+1

IR(mA)

VR(V)

Tc=25°C

Tc=75°C

Tc=100°C

Tc=125°C

Tc=150°C

Tc=50°C

1

10

100

10

20

50

100

200

500

C(pF)

F=1MHz

Tj=25°C

VR(V)

Figure 9.

Forward voltage drop versus

forward current (low level,

maximum values)

Figure 10.

Forward voltage drop versus

forward current (high level,

maximum values)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

IFM(A)

Tj=25°C

Tj=125°C

Tj=150°C

(typical values)

VFM(V)

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1

2

5

10

20

IFM(A)

VFM(V)

Tj=25°C

Tj=125°C

Tj=150°C

(typical values)

012345

0

20

40

60

80

100

Rth(j-a) (°C/W)

S(Cu) (cm²)

Epoxy printed circuit board FR4,

copper thickness = 35 µm