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HCPL-643X Datenblatt(PDF) 3 Page - Agilent(Hewlett-Packard)

Teilenummer HCPL-643X
Bauteilbeschribung  Hermetically Sealed, Very High Speed, Logic Gate Optocouplers
PDF  12 Pages
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Hersteller  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HCPL-643X Datenblatt(HTML) 3 Page - Agilent(Hewlett-Packard)

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1-526
7
5
6
8
1
2
3
4
VCC
GND
VE
VO
Functional Diagrams
8 Pin DIP
8 Pin DIP
20 Pad LCCC
Through Hole
Through Hole
Surface Mount
1 Channel
2 Channels
2 Channels
Note: All DIP devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with
separate VCC and ground connections.
Outline Drawings
VCC
7
5
6
8
VO1
GND
1
2
3
4
VO2
GND1
VO2
19
20
2
3
VO1
8
7
VCC2
VCC1
10
GND2
15
13
12
20 Terminal LCCC Surface Mount, 2 Channels
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
4.95 (0.195)
5.21 (0.205)
8.70 (0.342)
9.10 (0.358)
1.78 (0.070)
2.03 (0.080)
0.51 (0.020)
0.64
(0.025)
(20 PLCS)
1.52 (0.060)
2.03 (0.080)
METALIZED
CASTILLATIONS (20 PLCS)
2.16 (0.085)
TERMINAL 1 IDENTIFIER
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
1.14 (0.045)
1.40 (0.055)
3.81 (0.150)
MIN.
4.32 (0.170)
MAX.
9.40 (0.370)
9.91 (0.390)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.76 (0.030)
1.27 (0.050)
8.13 (0.320)
MAX.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
7.16 (0.282)
7.57 (0.298)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
8 Pin DIP Through Hole, 1 and 2 Channel



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