HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HL200101

Issued Date : 2000.01.15

Revised Date : 2001.12.06

Page No. : 3/3

H1N5817, H1N5818, H1N5819

HSMC Product Specification

DO-41 Dimension

*: Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.0280

0.0340

0.71

0.86

D

1.0000

-

25.40

-

B

1.0000

-

25.40

-

E

0.0800

0.1070

2.00

2.70

C

0.1600

0.2050

4.10

5.20

2.Controlling dimension: millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material:

• Lead: 42 Alloy ; solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

E

B

C

A

D

DO-41 Molded Plastic Package

HSMC Package Code: L