Data Sheet G10633EJ3V0DS00

7

RECOMMENDED SOLDERING CONDITIONS

Solder this product under the following recommended conditions.

For details of the recommended soldering conditions, refer to information document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended, consult NEC.

Surface Mount Type

µµµµPC305G2: 8-pin plastic SOP (5.72 mm (225))

Soldering Method

Soldering Conditions

Recommended

Conditions Symbol

Infrared reflow

Package peak temperature: 230

°C, Time: 30 sec max. (210°C min.),

Number of times: once

IR30-00-1

VPS

Package peak temperature: 215

°C, Time: 40 sec max. (200°C min.),

Number of times: once

VP15-00-1

Wave soldering

Solder bath temperature: 260

°C max., Time: 10 sec max., Number of times: once,

Preheating temperature: 120

°C max. (Package surface temperature)

WS60-00-1

Caution Do not use two or more soldering methods in combination (except partial heating).

Through Hole type

µµµµPC305C: 8-pin plastic DIP (7.62 mm (300))

Soldering Method

Soldering Conditions

Recommended

Conditions Symbol

Wave soldering

Solder bath temperature: 260

°C max., Time: 10 sec max.