µPD16337

12

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the conditions recommended below.

For soldering methods and conditions other than those recommended, please contact your NEC sales represen-

tative.

SURFACE MOUNT TYPE

For details of recommended soldering conditions, refer to the information document “Semiconductor Device

Mounting Technology Manual” (C10535E).

µPD16337GF-3BA

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 230

°C, Duration: 30 sec. MAX.

IR30-00-2

(at 210

VPS

Package peak temperature: 215

°C, Duration: 40 sec. MAX.

VP15-00-2

(at 200

Pin partial heating

Pin partial temperature: 300

°C MAX., Duration: 10 sec. MAX.,

Note For the storage period after dry-pack decapsulation, storage conditions are max. 25

°C, 65% RH.

Caution Use of more than one soldering method should be avoided (except in the case of pin partial

heating).

REFERENCES

NEC Semiconductor Device Reliability/Quality Control System (IEI-1212)

Quality Grade on NEC Semiconductor Devices (C11531E)