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AN3383 Datenblatt(PDF) 21 Page - STMicroelectronics |
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AN3383 Datenblatt(HTML) 21 Page - STMicroelectronics |
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21 / 29 page ![]() AN3383 Design guidelines for schematic and PCB layout Doc ID 018691 Rev 1 21/29 For better thermal dissipation, it is recommended that 2-ounce copper be used in the PCB. It is mandatory to have a large ground plane on the top and bottom layer and solder the slug on the PCB. Figure 30. Large ground planes on the top and bottom sides of the PCB Big ground plane on the top side Big ground plane on the bottom side AM045259v1 |
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