UPD6465CS datasheet(50/52 Pages) NEC

50 / 52 page

µPD6464A,6465

10.

RECOMMENDED SOLDERING CONDITIONS

Solder the

µPD6464A, 6465 under the conditions shown below.

For the details of the recommended soldering conditions, refer to “Semiconductor Device Mounting

Technology Manual” (C10535E).

For other soldering methods and conditions, consult NEC.

Surface mount devices

µPD6464AGT-×××: 24-pin plastic SOP (375 mil)

µPD6465GT-×××: 24-pin plastic SOP (375 mil)

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 235

°C or below (Package surface temperature),

IR35-00-2

Reflow time: 30 seconds or less (at 210

°C or higher),

Maximum number of reflow processes: 2 times,

Vapor Phase Soldering

Peak temperature: 215

°C or below (Package surface temperature),

VP15-00-2

Reflow time: 40 seconds or less (at 200

°C or higher),

Maximum number of reflow processes: 2 times,

Wave Soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less,

WS60-00-1

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120

°C or below (Package surface temperature),

Partial heating method

Pin temperature: 300

°C or below,

—

Heat time: 3 seconds or less (Per each side of the device).

Caution

Apply only one kind of soldering condition to a device, except for “partial heating method”, or

the device will be damaged by heat stress.

Through-hole devices

µPD6464ACS-×××: 24-pin plastic shrink DIP (300 mil)

µPD6465CS-×××: 24-pin plastic shrink DIP (300 mil)

Process

Conditions

Wave soldering

Solder temperature: 260

°C or below,

(only to leads)

Flow time: 10 seconds or less.

Partial heating method

Pin temperature: 300

°C or below,

Heat time: 3 seconds or less (Per each lead).

Caution

For through-hole devices, the wave soldering process must be applied only to leads, and make

sure that the package body does not get jet soldered.

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