MMSTA13/MMSTA14

NPN SURFACE MOUNT DARLINGTON TRANSISTOR

Features

•

Epitaxial Planar Die Construction

•

Complementary PNP Type Available

(MMSTA63/MMSTA64)

•

Ideal for Low Power Amplification and Switching

•

High Current Gain

•

Ultra-Small Surface Mount Package

•

Lead Free/RoHS Compliant (Note 2)

•

"Green" Device (Note 3 and 4)

Mechanical Data

•

Case: SOT-323

•

Case Material: Molded Plastic, "Green" Molding

Compound, Note 4. UL Flammability Classification

Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020C

•

Terminal Connections: See Diagram

•

Terminals: Solderable per MIL-STD-202, Method 208

•

Lead Free Plating (Matte Tin Finish annealed over Alloy

42 leadframe).

•

MMSTA13 Marking K2D, K3D, See Page 3

•

MMSTA14 Marking K3D, See Page 3

•

Ordering & Date Code Information: See Page 3

•

Weight: 0.006 grams (approximate)

SOT-323

Dim

Min

Max

A

0.25

0.40

B

1.15

1.35

C

2.00

2.20

D

0.65 Nominal

E

0.30

0.40

G

1.20

1.40

H

1.80

2.20

J

0.0

0.10

K

0.90

1.00

L

0.25

0.40

M

0.10

0.18

α

0

°

8

°

All Dimensi

mm

ons in

A

M

J

L

E

D

B C

H

K

G

BE

C

E

B

C

Characteristic

Symbol

Value

Unit

Collector-Base Voltage

30

V

Collector-Emitter Voltage

30

V

Emitter-Base Voltage

10

V

Collector Current - Continuous (Note 1)

300

mA

Power Dissipation (Note 1)

200

mW

Thermal Resistance, Junction to Ambient (Note 1)

625

°C/W

Operating and Storage Temperature Range

-55 to +150

°C

Notes: 1.

Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001,

which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2.

No purposefully added lead.

3.

Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

4.

Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to

Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

DS30165 Rev. 9 - 2

1 of 3

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MMSTA13/MMSTA14

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