IRFS4620PBF_15 datasheet(2/10 Pages) IRF

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IRFS/SL4620PbF

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Notes:

Repetitive rating; pulse width limited by max. junction

temperature.

Limited by TJmax, starting TJ = 25°C, L = 1.0mH

RG = 25Ω, IAS = 15A, VGS =10V. Part not recommended for use

above this value .

ISD ≤ 15A, di/dt ≤ 634A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C.

Pulse width ≤ 400µs; duty cycle ≤ 2%.

Coss eff. (TR) is a fixed capacitance that gives the same charging time

as Coss while VDS is rising from 0 to 80% VDSS.

Coss eff. (ER) is a fixed capacitance that gives the same energy as

Coss while VDS is rising from 0 to 80% VDSS.

When mounted on 1" square PCB (FR-4 or G-10 Material). For recom

mended footprint and soldering techniques refer to application note #AN-994.

Rθ is measured at TJ approximately 90°C

Static @ TJ = 25°C (unless otherwise specified)

Symbol

Parameter

Min. Typ. Max. Units

V(BR)DSS

Drain-to-Source Breakdown Voltage

200

–––

∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient

–––

0.23

––– V/°C

RDS(on)

Static Drain-to-Source On-Resistance

–––

63.7

77.5

Ω

VGS(th)

Gate Threshold Voltage

3.0

–––

5.0

IDSS

Drain-to-Source Leakage Current

–––

250

IGSS

Gate-to-Source Forward Leakage

–––

100

Gate-to-Source Reverse Leakage

–––

-100

RG(int)

Internal Gate Resistance

–––

2.6

–––

Ω

Dynamic @ TJ = 25°C (unless otherwise specified)

Symbol

Parameter

Min. Typ. Max. Units

gfs

Forward Transconductance

–––

Total Gate Charge

–––

Qgs

Gate-to-Source Charge

–––

8.2

–––

Qgd

Gate-to-Drain ("Miller") Charge

–––

7.9

–––

Qsync

Total Gate Charge Sync. (Qg - Qgd)

–––

td(on)

Turn-On Delay Time

–––

13.4

–––

Rise Time

–––

22.4

–––

td(off)

Turn-Off Delay Time

–––

25.4

–––

Fall Time

–––

14.8

–––

Ciss

Input Capacitance

–––

1710

–––

Coss

Output Capacitance

–––

125

–––

Crss

Reverse Transfer Capacitance

–––

Coss eff. (ER) Effective Output Capacitance (Energy Related)hÃ––– 113 –––

Coss eff. (TR) Effective Output Capacitance (Time Related)g

–––

317

–––

Diode Characteristics

Symbol

Parameter

Min. Typ. Max. Units

Continuous Source Current

(Body Diode)

ISM

Pulsed Source Current

(Body Diode)

VSD

Diode Forward Voltage

–––

1.3

trr

Reverse Recovery Time

–––

TJ = 25°C

VR = 100V,

–––

TJ = 125°C

IF = 15A

Qrr

Reverse Recovery Charge

–––

294

–––

TJ = 25°C

di/dt = 100A/µs

–––

432

–––

TJ = 125°C

IRRM

Reverse Recovery Current

–––

7.6

–––

TJ = 25°C

ton

Forward Turn-On Time

Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)

Conditions

VDS = 50V, ID = 15A

ID = 15A

VGS = 20V

VGS = -20V

MOSFET symbol

showing the

VDS = 100V

Conditions

VGS = 10V f

VGS = 0V

VDS = 50V

ƒ = 1.0MHz (See Fig.5)

VGS = 0V, VDS = 0V to 160V h(See Fig.11)

VGS = 0V, VDS = 0V to 160V g

TJ = 25°C, IS = 15A, VGS = 0V f

integral reverse

p-n junction diode.

Conditions

VGS = 0V, ID = 250µA

Reference to 25°C, ID = 5mA

VGS = 10V, ID = 15A f

VDS = VGS, ID = 100µA

VDS = 200V, VGS = 0V

VDS = 200V, VGS = 0V, TJ = 125°C

ID = 15A

RG = 7.3Ω

VGS = 10V f

VDD = 130V

ID = 15A, VDS =0V, VGS = 10V

–––

µA

100

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