Rev. 7d

 

Polymeric PTC

MERITEK

MPTS Series

(Low Rho)

The dimension in the table below provides the recommended pad layout for each MPTS0805 device. 

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3 °C/second max.

Preheat :

Temperature Min (Tsmin)

Temperature Max (Tsmax)

Time (tsmin to tsmax)

150 °C

200 °C

60-180 seconds

Time maintained above:

Temperature(TL)

Time (tL)

217 °C

60-150 seconds

Peak/Classification Temperature(Tp) :

260 °C

Time within 5°C of actual Peak :

Temperature (tp)

20-40 seconds

Ramp-Down Rate :

6 °C/second max.

Time 25 °C to Peak Temperature :

8 minutes max.

 

 

 

 

 

 

 

 

 

 

 

Pad dimensions (millimeters)

Device

A

Nominal

B

Nominal

C

Nominal

All 0805 Series

1.20

1.00

1.50

 

Solder reflow



Due to “Lead Free” nature, Temperature

and Dwell time for the soldering zone is

higher than those for Non-compliant

parts. This may cause damage to other

components.



Recommended max solder paste

thickness > 0.25mm.



Devices can be cleaned using standard

methods and aqueous solvent.



Rework should utilize standard industry

practices. These changes should apply to

all notes for each case size.



Storage Environment : < 30ºC / 60%RH

Caution:



If reflow temperatures exceed the

recommended profile, devices may not

meet the performance requirements.



Devices are not designed to be wave

soldered to the bottom side of the board.