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MAX792MC/D Datenblatt(PDF) 13 Page - Maxim Integrated Products |
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MAX792MC/D Datenblatt(HTML) 13 Page - Maxim Integrated Products |
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13 / 16 page ![]() Microprocessor and Non-Volatile Memory Supervisory Circuits ______________________________________________________________________________________ 13 Chip-Enable Signal Gating The MAX792/MAX820 provide internal gating of chip- enable (CE) signals, which prevents erroneous data from corrupting CMOS RAM in the event of an under- voltage condition. The MAX792/MAX820 use a series transmission gate from CE IN to CE OUT (Figure 1). During normal operation (reset not asserted), the CE transmission gate is enabled and passes all CE transi- tions. When reset is asserted, this path becomes dis- abled, preventing erroneous data from corrupting the CMOS RAM. The 10ns max CE propagation delay from CE IN to CE OUT enables the MAX792/MAX820 to be used with most µPs. If CE IN is low when reset asserts, CE OUT remains low for a short period to permit com- pletion of the current write cycle. Chip-Enable Input The CE transmission gate is disabled and CE IN is high impedance (disabled mode) while reset is asserted. During a power-down sequence when VCC passes the reset threshold, the CE transmission gate disables and CE IN immediately becomes high impedance if the volt- age at CE IN is high. If CE IN is low when reset is assert- ed, the CE transmission gate will disable at the moment CE IN goes high or 15µs after reset is asserted, whichever occurs first (Figure 9). This permits the cur- rent write cycle to complete during power-down. During a power-up sequence, the CE transmission gate remains disabled and CE IN remains high impedance regardless of CE IN activity, until reset is deasserted fol- lowing the reset timeout period. While disabled, CE IN is high impedance. When the CE transmission gate is enabled, the impedance of CE IN will appear as a 75 Ω (VCC = 5V) resistor in series with the load at CE OUT. The propagation delay through the CE transmission gate depends on VCC, the source impedance of the drive connected to CE IN, and the loading on CE OUT (see the Chip-Enable Propagation Delay vs. CE OUT Load Capacitance graph in the Typical Operating Characteristics). The CE propagation delay is produc- tion tested from the 50% point on CE IN to the 50% point on CE OUT using a 50 Ω driver and 50pF of load capacitance (Figure 10). For minimum propagation delay, minimize the capacitive load at CE OUT, and use a low-output-impedance driver. Chip-Enable Output When the CE transmission gate is enabled, the imped- ance of CE OUT is equivalent to 75 Ω in series with the source driving CE IN. In the disabled mode, the 75 Ω transmission gate is off and an active pull-up connects from CE OUT to VCC. This source turns off when the transmission gate is enabled. Applications Information Connect a 0.1µF ceramic capacitor from VCC to GND, as close to the device pins as possible. This reduces the probability of resets due to high-frequency power- supply transients. In a high-noise environment, addi- tional bypass capacitance from VCC to ground may be required. If long leads connect to the chip inputs, ensure that these lines are free from ringing, etc., which would forward bias the chip’s protection diodes. VCC CE IN RESET THRESHOLD CE OUT RESET RESET 70 µs 15 µs 70 µs Figure 9. Reset and Chip-Enable Timing MAX792 MAX820 50 Ω DRIVER 13 14 12 +5V GND CLOAD 3 VCC CE IN CE OUT Figure 10. CE Propagation Delay Test Circuit |
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