| Datenblatt-Suchmaschine für elektronische Bauteile |
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LX5202CDWP Datenblatt(PDF) 2 Page - Microsemi Corporation |
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LX5202CDWP Datenblatt(HTML) 2 Page - Microsemi Corporation |
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2 / 4 page ![]() 18-L INE , µP OWER SCSI T ERMINAT O R LX5202 PRODUCT DA T ABOOK 1996/1997 Copyright © 1998 Rev. 1.9 3/98 2 P RODUCTION D ATA S HEET ABSOLUTE MAXIMUM RATINGS (Note 1) TermPwr Voltage ......................................................................................................... +7V Signal Line Voltage ............................................................................................ 0V to +7V Regulator Output Current ........................................................................................... 1.2A Operating Junction Temperature Plastic (DWP Package) .......................................................................................... 150°C Storage Temperature Range ...................................................................... -65°C to 150°C Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C PACKAGE PIN OUTS Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal. DWP PACKAGE (Top View) DISCONNECT T1 T2 T3 T4 T5 HEAT SINK HEAT SINK HEAT SINK T6 T7 T8 T9 V TERM GND T18 T17 T16 T15 T14 HEAT SINK HEAT SINK HEAT SINK T13 T12 T11 T10 REG OUT 128 227 326 425 524 623 722 821 920 10 19 11 18 12 17 13 16 14 15 DWP PACKAGE: THERMAL RESISTANCE-JUNCTION TO LEADS, θθθθθ JL 18°C/W THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 40°C/W Junction Temperature Calculation: T J = TA + (PD x θJA). The θ JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. THERMAL DATA Disconnect Outputs Quiescent Current L Enabled 800µA H HI Z 60µA Open HI Z 60µA POWER UP / POWER DOWN FUNCTION TABLE |
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