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LX5212 Datenblatt(PDF) 2 Page - Microsemi Corporation

Teilenummer LX5212
Bauteilbeschribung  9-LINE LOW CAPACITANCE, 關POWER SCSI TERMINATOR
PDF  4 Pages
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Hersteller  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

LX5212 Datenblatt(HTML) 2 Page - Microsemi Corporation

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9-LINE LOW CAPACITANCE, µPOWER SCSI TERMINATOR
LX5212
PRODUCT DA T ABOOK 1996/1997
Copyright © 1997
Rev. 1.8
11/97
2
P RODUCTION D ATA S HEET
TermPwr Voltage ................................................................................................. +7V
Signal Line Voltage ................................................................................... 0V to +7V
Regulator Output Current ................................................................................... 0.4A
Operating Junction Temperature
Plastic (N, PWP, DP Packages) .................................................................... 150°C
Storage Temperature Range .............................................................. -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) .................................................... 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of the specified
terminal.
N PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
65°C/W
PWP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO LEADS,
θθθθθ
JL
27°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
100°C/W
DP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO LEADS,
θθθθθ
JL
20°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
50°C/W
Junction Temperature Calculation: T
J = TA + (PD x θJA).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
THERMAL DATA
Disconnect
Outputs
Quiescent
Current
L
Enabled
600µA
H
HI Z
0.5µA
Open
HI Z
0.5µA
POWER UP / POWER DOWN FUNCTION TABLE
ABSOLUTE MAXIMUM RATINGS
(Note 1)
PACKAGE PIN OUTS
N PACKAGE
(Top View)
PWP PACKAGE
(Top View)
T6
T5
REG OUT
N.C.
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
N.C.
V
TERM
T4
T3
1
24
223
322
421
520
619
718
817
916
10
15
11
14
12
13
T7
T8
T9
N.C.
GND
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
DISCONNECT
T1
T2
T7
T8
T9
N.C.
GND
DISCONNECT
T1
T2
1
16
215
314
413
512
611
710
89
T6
T5
REG OUT
N.C.
N.C.
V
TERM
T4
T3
T7
T8
T9
HEATSINK/GND
GND
DISCONNECT
T1
T2
T6
T5
REG OUT
HEATSINK/GND
HEATSINK/GND
V
TERM
T4
T3
16
215
314
413
512
611
710
89
DP PACKAGE
(Top View)



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