PR01, PR02, PR03

www.vishay.com

Vishay BCcomponents

Revision: 10-Sep-15

5

Document Number: 28729

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

FUNCTIONAL PERFORMANCE

The power that the resistor can dissipate depends on the operating temperature.

PR01 Temperature rise (

T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

PR02 Temperature rise (

T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

PR01 Temperature rise (

T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

PR02 Temperature rise (

T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

Ambient Temperature in °C

050

70

100

200

Derating

-55

150

20

0

40

60

80

100

50

0

0.4

1.2

0

0.8

10

20

30

40

ΔT

(K)

P (W)

20 mm

25 mm

15 mm

Ø 0.58 mm Cu-leads



Minimum distance from resistor body to PCB = 1 mm

Ø 0.58 mm FeCu-leads



Minimum distance from resistor body to PCB = 1 mm

1

15 mm

20 mm

25 mm

ΔT

(K)

P (W)

2

0

70

0

10

20

30

60

50

40

Ø 0.58 mm FeCu-leads



Minimum distance from resistor body to PCB = 1 mm

50

0

0.4

1.2

0

0.8

10

20

30

40

ΔT

(K)

P (W)

15 mm

20 mm

25 mm

Ø 0.78 mm Cu-leads



Minimum distance from resistor body to PCB = 1 mm

100

0

20

40

60

80

1

15 mm

20 mm

25 mm

∆T

(K)

P (W)

0

2