RCL e3

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Vishay Draloric

Revision: 21-Aug-14

4

Document Number: 20046

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1



CLAUSE

IEC

60068-2

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (

R)

Stability for product types:

STABILITY CLASS 2 OR BETTER

RCL e3

1

 to 2.2 M

4.5

-

Resistance

-

± 1 %

± 5 %

4.7

-

Voltage proof

No flashover or breakdown

4.13

-

Short time overload

U = 2.5 x

 2 x U

max.;

Duration acc. to style

± (0.25 % R + 0.05

)

± (0.5 % R + 0.05

)

4.17.2

58 (Td)

Solderability

Solder bath method;

Sn60Pb40

non-activated flux;

(235 ± 5) °C

(2 ± 0.2) s

Good tinning (

 95 % covered)

no visible damage

Solder bath method;

Sn96.5Ag3Cu0.5

non-activated flux;

(245 ± 5) °C

(3 ± 0.3) s

Good tinning (

 95 % covered)

no visible damage

4.8.4.2

-

Temperature

coefficient

(20/-55/20) °C and

(20/125/20) °C

± 100 ppm/K

± 200 ppm/K

4.32

Shear

(adhesion)

45 N

No visible damage

4.33

Substrate bending

Depth 2 mm;

3 times

No visible damage, no open circuit in bent position

± (0.25 % R + 0.05

)

4.19

14 (Na)

Rapid change of

temperature

30 min at -55 °C;

30 min at 125 °C

5 cycles

± (0.25 % R + 0.05

)

± (0.5 % R + 0.05

)

1000 cycles

± (1 % R + 0.05

)± (1 % R + 0.05 )

- 50

0

50

100

150

0

Ambient Temperature

50

100

70

ϑ

Derating

P