AQ-H

4

8. The following shows the packaging format

1) Tape and reel

Type

Tape dimensions

Dimensions of paper tape reel

8-pin SMD type

(1) When picked from 1/2/3/4-pin side: Part No. AQHrrrrAX (Shown above)

(2) When picked from 5/6/8-pin side: Part No. AQHrrrrAZ

1.5

dia.

.059

dia.

+0.1

–0

+.004

–0

0.3

±0.05

.012

±.002

Tractor feed holes

Device mounted

on tape

Direction of picking

1.55

±0.1 dia.

.061

±.004 dia.

4.5

±0.3

.177

±.012

2

±0.1

.079

±.004

10.1

±0.1

.400

±.004

4

±0.1

.157

±.004

1.75

±0.1

.069

±.004

10.2

±0.1

.402

±.004

12

±0.1

.472

±.004

7.5

±0.1

.295

±.004

16

±0.3

.630

±.012

21

±0.8

.827

±.031

80

±1 dia.

3.150

±.039 dia.

13

±0.5 dia.

.512

±.020 dia.

17.5

±2.0

.689

±.079

2

±0.5

.079

±.020

2

±0.5

.079

±.020

80

±1 dia.

3.150

±.039 dia.

300

±2 dia.

11.811

±.079 dia.

CAUTIONS FOR USE

1. For cautions regarding use, please

refer to ’03-’04 Solid State Relays

catalog.

2. The internal IC could be damaged if

a short forms between the I/O

terminals while the solid state relay is

powered.

3. Output spike voltages

1) The figure below shows an ordinary

circuit. Please add a snubber circuit or

varistor, as noise/surge on the load side

could damage the unit or cause

malfunctions.

Note) Connection of an external resister, etc.,

to terminal No. 5 (gate) is not necessary.

2) Even if spike voltages generated at the

load are limited with a clamp diode if the

circuit wires are long, spike voltages will

occur by inductance. Keep wires as short

as possible to minimize inductance.

4. Ripple in the input power supply

maintain min. 10 mA

2) Keep the LED operate current at 50 mA

5. When soldering terminals, keep

soldering time to within 10s at 260

°C

500

°F

6. Cleaning

The solid state relay forms an optical path

by coupling a light-emitting diode (LED)

and photodiode via transparent silicon

resin.

For this reason, avoid ultrasonic cleansing

if at all possible.

We recommend cleaning with an organic

solvent. If you cannot avoid using

ultrasonic cleansing, please ensure that

the following conditions are met, and

check beforehand for defects.

• Frequency: 27 to 29 kHz

• Ultrasonic output: No greater than 0.25

• Cleaning time: No longer than 30

seconds

• Cleanser used: Asahiklin AK-225

• Other: Submerge in solvent in order to

prevent the PCB and elements from being

contacted directly by the ultrasonic

vibrations.

Note: Applies to unit area ultrasonic output for

ultrasonic baths.

7. Soldering

1) When soldering PC board terminals,

keep soldering time to within 10 s at

260

2) When soldering surface-mount

terminals, the following conditions are

recommended.

(1) IR (Infrared reflow) soldering method

(2) Vapor phase soldering method

(3) Double wave soldering method

(4) Soldering iron method

Tip temperature: 280 to 300

572

°F

Wattage: 30 to 60 W

Soldering time: within 5 seconds

(5) Others

Check mounting conditions before using

other soldering methods (hot-air, hot

plate, pulse heater, etc.)

• The temperature profile indicates the

temperature of the soldered terminal on

the surface of the PC board. The ambient

temperature may increase excessively.

Check the temperature under mounting

conditions.

• The conditions for the infrared reflow

soldering apply when preheating using

the VPS method.

18

4

3

2

5

6

Load