| Datenblatt-Suchmaschine für elektronische Bauteile |
|
USB2532 Datenblatt(PDF) 17 Page - Microchip Technology |
|
|
|||||||||||||||||||||||||||||
USB2532 Datenblatt(HTML) 17 Page - Microchip Technology |
|
17 / 50 page ![]() USB 2.0 Hi-Speed 2-Port Hub Controller Datasheet 2014 Microchip Technology Inc. DS00001701A-page 17 Note 3.2 The LOCAL_PWR pin is sampled during the configuration state, immediately after negation of reset, to determine whether the device is bus-powered or self-powered. When configuration is complete, the latched value will not change until the next reset assertion. To enable dynamic local power switching, the DYNAMIC_POWER register at location 0x4134 must be programmed with 0x41. If dynamic power switching is not required, the DYNAMIC_POWER register should be left at the default value of 0xC1. Programming may be performed through the SMBus interface, or permanently via OTP. Refer to the Protouch MPT User Manual for additional information. Note 3.3 If using the local power detect function (LOCAL_PWR pin), the NON_REM[1:0] configuration straps cannot be used to configure the non-removable state of the USB ports. In this case, the non-removable state of the ports must be configured in internal device registers via the Protouch tool or SMBus. Note 3.4 Configuration strap values are latched on Power-On Reset (POR) and the rising edge of RESET_N (external chip reset). Configuration straps are identified by an underlined symbol name. Signals that function as configuration straps must be augmented with an external resistor when connected to a load. Refer to Section 6.3, "Device Configuration Straps," on page 27 for additional information. 1 +1.2V Core Power Supply VDDCR12 P +1.2V core power supply. A 1.0 μF (<1 Ω ESR) capacitor to ground is required for regulator stability. The capacitor should be placed as close as possible to the device. Refer to Chapter 4, "Power Connections," on page 20 for power connection information. Exposed Pad on package bottom (Figure 3.1) Ground VSS P Common ground. This exposed pad must be connected to the ground plane with a via array. Table 3.1 Pin Descriptions (continued) NUM PINS NAME SYMBOL BUFFER TYPE DESCRIPTION |
|
Link URL |
| War ALLDATASHEET hilfreich? [ DONATE ] |
Über Alldatasheet | Werbung | Kontakt | Privatsphäre und Datenschutz | Link zum Datenblatt | Linktausch | Hersteller All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |