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SP1ML-868 Datenblatt(PDF) 14 Page - STMicroelectronics |
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SP1ML-868 Datenblatt(HTML) 14 Page - STMicroelectronics |
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14 / 27 page ![]() Hardware design SP1ML 14/27 DocID026906 Rev 4 Figure 6. Soldering profile Time maintained above: – Temperature TL – Temperature TL 217 °C 60-70 sec Peak temperature (TP) 240 °C Time within 5 °C of actual peak temperature (TP)10-20 sec Ramp-down rate 6 °C/sec Time from 25 °C to peak temperature 8 minutes max. Table 8. Soldering profile (continued) Profile feature Lead-free assembly GSPG1409141835SMD |
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