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STTH1R04AY Datenblatt(PDF) 5 Page - STMicroelectronics |
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STTH1R04AY Datenblatt(HTML) 5 Page - STMicroelectronics |
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5 / 10 page ![]() DocID024449 Rev 1 5/10 STTH1R04-Y Characteristics 10 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead Figure 11. Forward recovery time versus dIF/dt (typical values) Figure 12. Thermal resistance junction to ambient versus copper surface under each lead 0 5 10 15 20 25 30 35 40 45 50 55 0 50 100 150 200 250 300 350 400 450 500 t FR(ns) I F=1 A T j=125 °C dIF/dt(A/µs) Rth(j-a)(C/W) ° 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SCU(cm²) SMA epoxy printed board FR4, copper thickness Cu = 35 µm Rth(j-a)(C/W) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SMB ° SCU(cm²) epoxy printed board FR4, copper thickness Cu = 35 µm |
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