3

CMPA1D1E030D Rev 0, Preliminary

Cree, Inc.

4600 Silicon Drive

Durham, North Carolina, USA 27703

USA Tel: +1.919.313.5300

Fax: +1.919.869.2733

Fax: +1.919.869.2733

www.cree.com/RF

Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the

Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective

owners and do not imply specific product and/or vendor endorsement, sponsorship or association.

Block Diagram Showing Additional Capacitors for Operation Over 13.75 to 14.5 GHz

Designator

Description

Quantity

C1,C2,C3,C4,C5,C6,C7,C8,C9,C10

CAP,51pF,+/-10%,SINGLELAYER,0.030”,Er3300,100V,Ni/

Au TERMINATION

10

C11,C12,C13,C14

CAP,680pF,+/-10%,SINGLELAYER,0.070”,Er3300,100V,

Ni/AuTERMINATION

4

Notes:

1

The input, output and decoupling capacitors should be attached as close as possible to the

die- typical distance is 5 to 10 mils with a maximum of 15 mils.

2

The MMIC die and capacitors should be connected with 2 mil gold bond wires.