NJW4155

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Ver.2015-11-13

THERMAL CHARACTERISTICS

PARAMETER

SYMBOL

VALUE

UNIT

Junction-to-ambient

thermal resistance

ja

HSOP8

158 (*7)

50 (*8)

C/W

TO-252-5

105 (*9)

40 (*8)

Junction-to-Top of package

characterization parameter

jt

HSOP8

28 (*7)

12 (*8)

C/W

TO-252-5

17 (*9)

12 (*8)

(*7): Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 2Layers)

(*8): Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 4Layers)

(For 4Layers: Applying 74.2×74.2mm inner Cu area and a thermal via hole to a board based on JEDEC standard JESD51-5)

(*9): Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard size, 2Layers, Cu area 100mm

POWER DISSIPATION vs. AMBIENT TEMPERATURE

0

500

1000

1500

2000

2500

3000

-50

-25

0

25

50

75

100

125

150

Ambient Temperature Ta (°C)

NJW4155GM1 (HSOP8 Package)

Power Dissipation vs. Ambient Temperature

(Tj=~150°C)

At on 4 layer PC Board (*8)

At on 2 layer PC Board (*7)

0

500

1000

1500

2000

2500

3000

3500

-50

-25

0

25

50

75

100

125

150

Ambient Temperature Ta (°C)

NJW4155DL3 (TO-252-5 Package)

Power Dissipation vs. Ambient Temperature

(Tj=~150°C)

At on 4 layer PC Board (*8)

At on 2 layer PC Board (*9)