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HMC427LP3 Datenblatt(PDF) 4 Page - Hittite Microwave Corporation

Teilenummer HMC427LP3
Bauteilbeschribung  GaAs MMIC POSITIVE CONTROL TRANSFER SWITCH, DC - 8.0 GHz
PDF  6 Pages
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Hersteller  HITTITE [Hittite Microwave Corporation]
Direct Link  http://www.hittite.com
Logo HITTITE - Hittite Microwave Corporation

HMC427LP3 Datenblatt(HTML) 4 Page - Hittite Microwave Corporation

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MICROWAVE CORPORATION
14 - 245
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
14
HMC427LP3
v05.0604
GaAs MMIC POSITIVE CONTROL
TRANSFER SWITCH, DC* - 8.0 GHz
Absolute Maximum Ratings
Outline Drawing
Bias Voltage Range (Vdd)
+7.0 Vdc
Control Voltage Range (A & B)
-0.5V to Vdd +1.0 Vdc
Channel Temperature
150 °C
Thermal Resistance
130 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Maximum Input Power
+27 dBm
Note:
DC blocking capacitors are required at ports RF1, 2, 3,
& 4. Their value will determine the lowest transmission
frequency.
NOTES:
1. MATERIAL PACKAGE BODY: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY
3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
6. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB
LAND PATTERN.



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