LM3205TLXSLASHNOPB datasheet(3/28 Pages) TI1

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LM3205

www.ti.com

SNVS388E – JULY 2005 – REVISED APRIL 2013

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

VDD, PVIN to SGND

−0.2V to +6.0V

PGND to SGND

−0.2V to +0.2V

EN, FB, VCON

(SGND

−0.2V) to (VDD +0.2V) w/6.0V max

(PGND

−0.2V) to (PVIN +0.2V) w/6.0V max

PVIN to VDD

−0.2V to +0.2V

Continuous Power Dissipation(4)

Internally Limited

Junction Temperature (TJ-MAX)

+150°C

Storage Temperature Range

−65°C to +150°C

Maximum Lead Temperature (Soldering, 10 sec)

+260°C

ESD Rating(5)(6)

Human Body Model

2 kV

Machine Model

200V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply specified performance limits. For specified performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins. The LM3205 is designed for mobile phone applications where turn-on after

power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal

Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin low until the input voltage exceeds

2.7V.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 130°C (typ.).

(5)

The Human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. (MIL-STD-883 3015.7) The machine

model is a 200pF capacitor discharged directly into each pin.

(6)

TI recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper ESD handling techniques

can result in damage.

OPERATING RATINGS

(1) (2)

Input Voltage Range

2.7V to 5.5V

Recommended Load Current

0mA to 650mA

Junction Temperature (TJ) Range

−30°C to +125°C

Ambient Temperature (TA) Range

(3)

−30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply specified performance limits. For specified performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins. The LM3205 is designed for mobile phone applications where turn-on after

power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal

Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin low until the input voltage exceeds

2.7V.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

THERMAL PROPERTIES

Junction-to-Ambient Thermal DSBGA

100°C/W

Resistance (

θJA), DSBGA YZR08 Package

(1)

Junction-to-Ambient Thermal WSON

55°C/W

Resistance (

θJA), WSON DSC0010A Package

(1)

DSBGA: Junction-to-ambient thermal resistance (

θJA) is taken from thermal measurements, performed under the conditions and

guidelines set forth in the JEDEC standard JESD51-7. A 4 layer, 4" x 4", 2/1/1/2 oz. Cu board as per JEDEC standards is used for the

measurements. WSON: The value of (

θJA) in WSON-10 could fall in a range of 50°C/W to 150°C/W (if not wider), depending on PWB

material, layout, and environmental conditions. In applications where high maximum power dissipation exits (high VIN , high IOUT ),

special care must be paid to thermal dissipation areas. For more information on these topics for WSON, refer to

Application Note 1187: Leadless Leadframe Package (LLP) (SNOA401) and the Power Efficiency and Power Dissipation section

of this datasheet

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