Product Specification

Revision: D

Date: February 29, 2016

© Samtec, Inc.

Page 8

7.5 Stencil Thickness: The stencil thickness is

.006” (0,15mm).

7.6 Placement: Machine placement of the parts is recommended.

7.7 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through

Nitrogen gas infusion) in the reflow process to improve solderability.

7.8 Rework Guidelines: Samtec recommends following these rework guidelines as needed: QXX/BXX Connector

Rework Methods

7.9 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec offers

two different types:

7.9.1

Traditional Standoffs (SO)

– Rigid design to statically support board-to-board applications. See

options here:

SO - Board Stacking Standoff

7.9.2

Jack Screw Standoffs (JSO)

– Serve same function as traditional standoffs but unique, nested

construction facilitates the mating and unmating process. This is especially helpful for multiple

connector applications where the mating and unmating forces increase with the number of

connectors used. See options here:

JSO - Jack Screw Standoffs

7.10 Cleaning: Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and

conditions designated in the EIA-364-11A standard.

8.0 ADDITIONAL RESOURCES

8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at

CES@samtec.com

8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at

SIG@samtec.com

8.3 For additional processing information, contact our Interconnect Processing Group at IPG@samtec.com

8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental

Compliance Group at PEC@samtec.com

USE OF PRODUCT SPECIFICATION SHEET

This Product Specification Sheet (“PSS”) is a brief summary of information related to the Product identified. As a summary, it

should only be used for the limited purpose of considering the purchase/use of Product. For specific, detailed information, including

but not limited to testing and Product footprint, refer to Section 2.0 of this document and the links there provided to test reports and

prints. This PSS is the property of Samtec, Inc. (“Samtec”) and contains proprietary information of Samtec, our various licensors, or

both. Samtec does not grant express or implied rights or license under any patent, copyright, trademark or other proprietary rights

and the use of the PSS for building, reverse engineering or replication is strictly prohibited. By using the PSS, the user agrees to not

infringe, directly or indirectly, upon any intellectual property rights of Samtec and acknowledges that Samtec, our various licensors,

or both own all intellectual property therein. The PSS is presented “AS IS”. While Samtec makes every effort to present excellent

information, the PSS is only provided as a guideline and does not, therefore, warrant it is without error or defect or that the PSS

contains all necessary and/or relevant information about the Product. The user agrees that all access and use of the PSS is at its own

risk. NO WARRANTIES EXPRESSED OR IMPLIED, INCLUDING ANY WARRANTY OF MERCHANTABILITY,

FITNESS FOR A PARTICULAR PURPOSE OR OF ANY KIND WHATSOEVER ARE PROVIDED.