www.ti.com

EXAMPLE BOARD LAYOUT

(5.8)

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

8X (1.5)

8X (0.45)

6X (0.65)

(R

)

TYP

0.05

4221848/A 02/2015

TSSOP - 1.2 mm max height

PW0008A

SMALL OUTLINE PACKAGE

SYMM

SYMM

LAND PATTERN EXAMPLE

SCALE:10X

1

4

5

8

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOT TO SCALE

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

SOLDER MASK

DEFINED