LP2986

SNVS137I – MARCH 1999 – REVISED SEPTEMBER 2015

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Table of Contents

7.4

Device Functional Modes........................................ 14

1

Features .................................................................. 1

8

Application and Implementation ........................ 15

2

Applications ........................................................... 1

8.1

Application Information............................................ 15

3

Description ............................................................. 1

8.2

Typical Applications ................................................ 15

4

Revision History..................................................... 2

9

Power Supply Recommendations ...................... 19

5

Pin Configuration and Function ........................... 3

10

Layout................................................................... 20

6

Specifications......................................................... 4

10.1

Layout Guidelines ................................................. 20

6.1

Absolute Maximum Ratings ...................................... 4

10.2

Layout Examples................................................... 20

6.2

ESD Ratings.............................................................. 4

10.3

WSON Mounting ................................................... 21

6.3

Recommended Operating Conditions ....................... 4

11

Device and Documentation Support ................. 22

6.4

Thermal Information .................................................. 5

11.1

Documentation Support ........................................ 22

6.5

Electrical Characteristics........................................... 5

11.2

Community Resources.......................................... 22

6.6

Typical Characteristics .............................................. 8

11.3

Trademarks ........................................................... 22

7

Detailed Description ............................................ 13

11.4

Electrostatic Discharge Caution ............................ 22

7.1

Overview ................................................................. 13

11.5

Glossary ................................................................ 22

7.2

Functional Block Diagram ....................................... 13

12

Mechanical, Packaging, and Orderable

7.3

Feature Description................................................. 13

Information ........................................................... 22

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision H (April 2013) to Revision I

Page

•

Added Device Information and Pin Configuration and Functions sections, ESD Ratings table, update Thermal

Values, Feature Description, Device Functional Modes, Application and Implementation, Power Supply

Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable

Information sections................................................................................................................................................................ 1

•

Deleted Lead Temp from Abs Max table (in POA); delete Heatsinking sections re: specific packages (outdated info) ....... 4

Changes from Revision G (April 2013) to Revision H

Page

•

Changed layout of National Data Sheet to TI format ........................................................................................................... 18

2

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