LP2996A

SNOSCY7 – JUNE 2014

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Pin Descriptions (continued)

reference voltage for the Northbridge chipset and memory. Since these inputs are typically an extremely high

be used, located close to the pin, to help with noise. A ceramic capacitor in the range of 0.1 µF to 0.01 µF is

recommended. This output remains active during the shutdown state and thermal shutdown events for the suspend to

RAM functionality.

regulating the output precisely to VDDQ / 2. The LP2996A is designed to handle peak transient currents of up to ± 3 A

Performance Characteristics section. If a transient is expected to last above the maximum continuous current rating for

a significant amount of time then the output capacitor should be sized large enough to prevent an excessive voltage

drop. Despite the fact that the LP2996A is designed to handle large transient output currents it is not capable of

handling these for long durations, under all conditions. The reason for this is the standard packages are not able to

thermally dissipate the heat as a result of the internal power loss. If large currents are required for longer durations,

then care should be taken to ensure that the maximum junction temperature is not exceeded. Proper thermal derating

should always be used (please refer to the Thermal Dissipation section). If the junction temperature exceeds the

6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

AVIN to GND

−0.3

6

V

PVIN to GND

–0.3

AVIN

−0.3

6

V

Junction Temperature

150

°C

Lead Temperature (Soldering, 10 sec)

260

°C

(1)

Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating range indicates conditions for which

the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and test conditions

see Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

−65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

Electrostatic discharge

1

kV

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

0

125

°C

AVIN to GND

2.2

5.5

V

PVIN Supply Voltage

0

AVIN

SD Input Voltage

0

AVIN

(1)

At elevated temperatures, devices must be derated based on thermal resistance.

4

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