1

2

3

4

8

VCOM

7

6

5

16

E

9

15

14

13

12

11

10

1B

2B

3B

4B

7B

6B

5B

1C

2C

3C

4C

7C

6C

5C

GND

Time (s)

-0.004

0

0.004

0.008

0.012

0.016

0

1

2

3

4

5

6

7

8

9

10

11

12

13

D001

Time (s)

-0.004

0

0.004

0.008

0.012

0.016

0

2

4

6

8

10

12

14

D001

13

ULN2003B

www.ti.com

SLRS064B – JUNE 2014 – REVISED AUGUST 2016

Product Folder Links: ULN2003B

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Copyright © 2014–2016, Texas Instruments Incorporated

TI recommends to limit ULN2003B IC’s die junction temperature to less than 125°C. The IC junction temperature

is directly proportional to the on-chip power dissipation.

9.2.3 Application Curves

Figure 24. Output Response With Activation

of Coil (Turn On)

Figure 25. Output Response With De-activation

of Coil (Turn Off)

10 Power Supply Recommendations

This part does not need a power supply; however, the COM pin is typically tied to the system power supply.

When this is the case, it is very important to make sure that the output voltage does not exceed the COM pin

voltage. This will heavily forward bias the fly-back diodes and cause a large current to flow into COM, potentially

damaging the on-chip metal or over-heating the part.

11 Layout

11.1 Layout Guidelines

Thin traces can be used on the input due to the low current logic that is typically used to drive UNL2003B. Care

must be taken to separate the input channels as much as possible, as to eliminate cross-talk. Thick traces are

recommended for the output, in order to drive whatever high currents that may be needed. Wire thickness can be

determined by the trace material's current density and desired drive current.

Since all of the channels currents return to a common emitter, it is best to size that trace width to be very wide.

Some applications require up to 2.5 A.

11.2 Layout Example

Figure 26. Package Layout