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TMS320C6472ECTZ Datenblatt(PDF) 6 Page - Texas Instruments

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Teilenummer TMS320C6472ECTZ
Bauteilbeschribung  TMS320C6472 Fixed-Point Digital Signal Processor
PDF  269 Pages
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TMS320C6472ECTZ Datenblatt(HTML) 6 Page - Texas Instruments

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TMS320C6472
SPRS612G
– JUNE 2009 – REVISED JULY 2011
www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
This revision history highlights the technical changes made to the document in this revision.
C6472 Revisions
SEE
ADDITIONS/MODIFICATIONS/DELETIONS
Section 1
Features:
Added CTZ package to Features list item
Section 1.1
Changed section title to: CTZ/ZTZ BGA Package (Bottom View)
Changed Figure 1-1 caption to: CTZ/ZTZ 737-Pin Ball Grid Array (BGA) Package (Bottom View)
Section 2.1
Device Characteristics:
Modified Description for BGA Package in Table 2-1, Characteristics of the C6472 Processor
Section 2.8.2.1
Device and Development-Support Tool Nomenclature:
Modified Figure 2-13, TMS320C64x+
™ DSP Device Nomenclature (including the TMS320C6472 DSP)
Section 7.5.2
EDMA3 Peripheral Register Descriptions:
Added DMAQNUM4-7 to Table 7-5, EDMA3 Registers
Section 8.1
Thermal Data:
Changed Table 8-1 title to: Thermal Resistance Characteristics (S-PBGA Package) [CTZ/ZTZ]
Section 8.2
Packaging Information:
Added CTZ mechanical package drawing
6
Contents
Copyright
© 2009–2011, Texas Instruments Incorporated
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Product Folder Link(s) :TMS320C6472



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