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INA118P Datenblatt(PDF) 4 Page - Texas Instruments |
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INA118P Datenblatt(HTML) 4 Page - Texas Instruments |
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4 / 29 page ![]() INA118 SBOS027A – SEPTEMBER 2000 – REVISED JANUARY 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage ±18 V Analog input voltage ±40 V Output short-circuit (to ground) Continuous Operating temperature –40 125 °C Junction temperature 150 °C Lead temperature (soldering, 10 s) 300 °C Tstg Storage temperature –40 125 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT V Power supply ±2.25 ±15 ±18 V VO = 0 Input common-mode voltage V– + 1.1 V+ – 1 V TA Ambient temperature –55 150 °C 6.4 Thermal Information INA118 THERMAL METRIC(1) D (SOIC) P (PDIP) UNIT 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 115 48 °C/W RθJC(top) Junction-to-case (top) thermal resistance 62 37 °C/W RθJB Junction-to-board thermal resistance 59 25 °C/W ψJT Junction-to-top characterization parameter 14 14 °C/W ψJB Junction-to-board characterization parameter 58 25 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: INA118 |
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