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AIC6191 Datenblatt(PDF) 8 Page - Analog Intergrations Corporation

Teilenummer AIC6191
Bauteilbeschribung  Single Channel Bare-Bone USB Switch
PDF  9 Pages
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Hersteller  AIC [Analog Intergrations Corporation]
Direct Link  http://www.analog.com.tw
Logo AIC - Analog Intergrations Corporation

AIC6191 Datenblatt(HTML) 8 Page - Analog Intergrations Corporation

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AIC6191
8
APPLICATION INFORMATION
 Current Limit
Current limiting is invoked when the load exceeds
the set over-current threshold. It protects the
output MOSFET switches from damage resulting
from undesirable short circuit conditions or excess
inrush current, which is often encountered during
hot plug-in.
 Thermal Shutdown
When junction temperature of AIC6191 exceeds
145
C for any reasons, the thermal shutdown
function turns MOSFET switch off. A hysteresis of
20
C prevents the MOSFETs from turning back on
until the chip temperature drops below 125
C.
thermal shutdown circuit functions only when the
switch is enabled.
Under-voltage Lockout
UVLO prevents the MOSFET switch from turning
on until input voltage exceeds 2.5V typically. After
the switch turns on, if input voltage drops below
2.3V typically, UVLO shuts off the output MOSFET.
Supply Filtering
A 0.1
F to 1F bypass capacitor from IN to GND,
located near the device, is strongly recommended
to control supply transients. Without a bypass
capacitor, an output short may cause sufficient
ringing on the input (from supply lead inductance)
to
damage
internal
control
circuitry.
Input
transients must not exceed the maximum VIN
voltage for a short duration.
Transient Requirements
USB supports dynamic attachment (hot plug-in) of
peripherals. A current surge is caused by the input
capacitance of downstream device. Ferrite beads
are recommended in series with all power and
ground connector pins. Ferrite beads reduce EMI
and limit the inrush current during hot-attachment
by filtering high-frequency signals.
 Printed Circuit Layout
The power circuitry of USB printed circuit boards
requires a customized layout to maximize thermal
dissipation and to minimize voltage drop and EMI.



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