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ZXLD1370Q Datenblatt(PDF) 3 Page - Diodes Incorporated |
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ZXLD1370Q Datenblatt(HTML) 3 Page - Diodes Incorporated |
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3 / 37 page ![]() ZXLD1370Q Document number: DS37117 Rev. 1 - 2 3 of 37 www.diodes.com August 2015 © Diodes Incorporated ZXLD1370Q Pin Descriptions (cont.) Pin Name Pin Type (Note 5) Function SGND 6 P Signal ground (Connect to 0V) PGND 7 P Power ground - Connect to 0V and pin 8 to maximize copper area N/C 8 - Not Connected internally – recommend connection to pin 7, (PGND), to maximize PCB copper for thermal dissipation N/C 9 Not Connected internally – recommend connection pin 10 (GATE) to permit wide copper trace to gate of MOSFET GATE 10 O Gate drive output to external NMOS transistor – connect to pin 9 VAUX 11 P Auxiliary positive supply to internal switch gate driver. Connect to VIN, or auxiliary supply from 6V to 15V supply to reduce internal power dissipation (Refer to application section for more details) Decouple to ground with capacitor close to device (refer to Applications section) VIN 12 P Input supply to device (6V to 60V). Decouple to ground with capacitor close to device (refer to Applications section) ISM 13 I Current monitor input. Connect current sense resistor between this pin and VIN The nominal voltage across the resistor is 225mV FLAG 14 O Flag open drain output Pin is high impedance during normal operation Pin switches low to indicate a fault, or warning condition PWM 15 I Digital PWM output current control Pin driven either by open Drain or push-pull 3.3V or 5V logic levels. Drive with frequency higher than 100Hz to gate output ‘on’ and ‘off’ during dimming control. The device enters standby mode when PWM pin is driven with logic low level for more than 15ms nominal (Refer to application section for more details) GI 16 I Gain setting input Used to set the device in Buck mode or Boost, Buck-boost modes Connect to ADJ in Buck mode operation For Boost and Buck-boost modes, connect to resistive divider from ADJ to SGND. This defines the ratio of switch current to LED current (see application section). The GI pin has an internal clamp that limits the internal node to less than 3V. This provides some failsafe should they get overdriven EP PAD P Exposed paddle. Connect to 0V plane for electrical and thermal management Absolute Maximum Ratings (Note 6) (Voltages to GND, unless otherwise specified.) Symbol Parameter Rating Unit VIN Input Supply Voltage Relative to GND -0.3 to +65 V VAUX Auxiliary Supply Voltage Relative to GND -0.3 to +65 V VISM Current Monitor Input Relative to GND -0.3 to +65 V VSENSE Current Monitor Sense Voltage (VIN-VISM) -0.3 to +5 V VGATE Gate Driver Output Voltage -0.3 to +20 V IGATE Gate Driver Continuous Output Current 18 mA VFLAG Flag Output Voltage -0.3 to 40 V VPWM, VADJ, VTADJ, VGI Other Input Pins -0.3 to +5.5 V TJ Maximum Junction Temperature +150 °C TST Storage Temperature -55 to +150 °C Note: 6. For correct operation, SGND and PGND should always be connected together. Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at conditions between maximum recommended operating conditions and absolute maximum ratings is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. |
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