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REG113 Datenblatt(PDF) 11 Page - Texas Instruments |
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REG113 Datenblatt(HTML) 11 Page - Texas Instruments |
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11 / 16 page ![]() REG113 11 SBVS031D www.ti.com FIGURE 7. Thermal Resistance versus PCB Area for the MSOP-8. THERMAL RESISTANCE vs PCB COPPER AREA 160 150 140 130 120 110 100 90 80 70 60 012345 Copper Area (inches2) Power dissipation depends on input voltage, load condi- tions, and duty cycle and is equal to the product of the average output current times the voltage across the output element (VIN to VOUT voltage drop): PV V I DIN OUT OUT =• ( – ) (3) Power dissipation can be minimized by using the lowest possible input voltage necessary to assure the required output voltage. |
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