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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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MSC1211 Datenblatt(PDF) 2 Page - Texas Instruments |
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MSC1211 Datenblatt(HTML) 2 Page - Texas Instruments |
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2 / 105 page  MSC1211, MSC1212 MSC1213,MSC1214 SBAS323D − JUNE 2004 − REVISED SEPTEMBER 2005 www.ti.com 2 PACKAGE/ORDERING INFORMATION(1) PRODUCT FLASH MEMORY 16-BIT DACS I2C PACKAGE-LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING MSC1211Y2 4k 4 Y TQFP-64 PAG −40 °C to +125°C MSC1211Y2 MSC1211Y3 8k 4 Y TQFP-64 PAG −40 °C to +125°C MSC1211Y3 MSC1211Y4 16k 4 Y TQFP-64 PAG −40 °C to +125°C MSC1211Y4 MSC1211Y5 32k 4 Y TQFP-64 PAG −40 °C to +125°C MSC1211Y5 MSC1212Y2 4k 4 N TQFP-64 PAG −40 °C to +125°C MSC1212Y2 MSC1212Y3 8k 4 N TQFP-64 PAG −40 °C to +125°C MSC1212Y3 MSC1212Y4 16k 4 N TQFP-64 PAG −40 °C to +125°C MSC1212Y4 MSC1212Y5 32k 4 N TQFP-64 PAG −40 °C to +125°C MSC1212Y4 MSC1213Y2 4k 2 Y TQFP-64 PAG −40 °C to +125°C MSC1213Y2 MSC1213Y3 8k 2 Y TQFP-64 PAG −40 °C to +125°C MSC1213Y3 MSC1213Y4 16k 2 Y TQFP-64 PAG −40 °C to +125°C MSC1213Y4 MSC1213Y5 32k 2 Y TQFP-64 PAG −40 °C to +125°C MSC1213Y5 MSC1214Y2 4k 2 N TQFP-64 PAG −40 °C to +125°C MSC1214Y2 MSC1214Y3 8k 2 N TQFP-64 PAG −40 °C to +125°C MSC1214Y3 MSC1214Y4 16k 2 N TQFP-64 PAG −40 °C to +125°C MSC1214Y4 MSC1214Y5 32k 2 N TQFP-64 PAG −40 °C to +125°C MSC1214Y5 (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this datasheet, or refer to our web site at www.ti.com. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS(1) MSC1211/12/13/14 UNITS Analog Inputs Input current Momentary 100 mA Input current Continuous 10 mA Input voltage AGND − 0.3 to AVDD + 0.3 V Power Supply DVDD to DGND −0.3 to +6 V AVDD to AGND −0.3 to +6 V AGND to DGND −0.3 to +0.3 V VREF to AGND −0.3 to AVDD + 0.3 V Digital input voltage to DGND −0.3 to DVDD + 0.3 V Digital output voltage to DGND −0.3 to DVDD + 0.3 V Maximum junction temperature (TJ Max) +150 °C Operating temperature range −40 to +125 °C Storage temperature range −65 to +150 °C Lead temperature (soldering, 10s) +235 °C Junction to ambient ( qJA) High K (2s 2p) 48.9 °C/W Thermal resistance Junction to ambient ( qJA) Low K (1s) 72.9 °C/W Thermal resistance Junction to case ( qJC) 12.2 °C/W Package power dissipation (TJ Max − TAMBIENT)/qJA W Output current, all pins 200 mA Output pin short-circuit 10 s Digital Outputs Output current Continuous 100 mA I/O source/sink current 100 mA Power pin maximum 300 mA (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. |
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