63CPQ080 datasheet(3/5 Pages) SMC

Teilenummer	63CPQ080

Bauteilbeschribung	High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance

PDF	5 Pages

Scroll/Zoom	100%

Hersteller	SMC [Sangdest Microelectronic (Nanjing) Co., Ltd]

Direct Link	http://www.smc-diodes.com/

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3 / 5 page

SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N0208, Rev. A

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

63CPQ080

63CPQ100

Electrical Characteristics:

Characteristics

Symbol

Condition

Max.

Units

VF1

@ 30A, Pulse, TJ = 25 °C

0.80

Forward Voltage Drop

(per leg) *

VF2

@ 30A, Pulse, TJ = 125 °C

0.75

Reverse Current (per leg) *

IR1

@VR = rated VR

TJ = 25 °C

0.3

IR2

@VR = rated VR

TJ = 125 °C

25.0

Junction Capacitance

(per leg)

@VR = 5V, TC = 25 °C

fSIG = 1MHz

1300

Typical Series Inductance

(per leg)

Measured lead to lead 5 mm from

package body

7.5

Voltage Rated of Change

dv/dt

10,000

V/μs

* Pulse Width < 300µs, Duty Cycle <2%

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Junction Temperature

-55 to +150

°C

Storage Temperature

Tstg

-55 to +150

°C

0.8(per leg)

Maximum Thermal

Resistance Junction to Case

(per leg)

RθJC

DC operation

0.4(per device)

°C/W

Maximum Thermal

Resistance, Case to Heat

Sink

RθCS

Mounting surface, smooth and

greased

0.25

°C/W

Approximate Weight

6.7

Case Style

TO-247AD

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