www.irf.com

17

iP1001

Mechanical Drawing

Refer to the following application notes for detailed guidelines and suggestions when implementing

iPOWIR Technology products:

AN-1028: Recommended Design, Integration and Rework Guidelines for International Rectifier’s

iPOWIR Technology BGA Packages

This paper discusses the assembly considerations that need to be taken when mounting iPOWIR BGA’s

on printed circuit boards. This includes soldering, pick and place, reflow, inspection, cleaning and

reworking recommendations.

AN-1029: Optimizing a PCB Layout for an iPOWIR Technology Design

This paper describes how to optimize the PCB layout design for both thermal and electrical performance.

This includes placement, routing, and via interconnect suggestions.

AN-1030: Applying iPOWIR Products in Your Thermal Environment

This paper explains how to use the Power Loss and SOA curves in the data sheet to validate if the

operating conditions and thermal environment are within the Safe Operating Area of the iPOWIR product.

0.12 [.005] C

2. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].

3. CONTROLLING DIMENSION: MILLIMETER

1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.

NOTES:

(4X 1.0 [.039])

2.66 [.1047]

2.46 [.0969]

TOP VIEW

BOTTOM VIEW

SIDE VIEW

3.11 [.1224]

2.81 [.1107]

C

0.45 [.0177]

0.35 [.0138]

PACKAGE BODY.

BALL DIAMETER, IN A PLANE PARALLEL TO DATUM C.

SPHERICAL CROWNS OF THE SOLDER BALLS.

4. SOLDER BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.

7

SOLDER BALL DIAMETER IS MEASURED AT THE MAXIMUM SOLDER

5

PRIMARY DATUM C (SEATING PLANE) IS DEFINED BY THE

6

BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE

5

0.15 [.006] C

CORNER ID

BALL A1

2X

6

14.00

[.551]

B

14.00

[.551]

A

0.15 [.006] C

2X

6

0.15 [.006]

C A B

0.08 [.003]

C

218X Ø

0.45 [.0178]

0.55 [.0216]

7

0.40

[.016]

4X

0.80

[.032]

30X