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STM32L083VB Datenblatt(PDF) 11 Page - STMicroelectronics

Teilenummer STM32L083VB
Bauteilbeschribung  Ultra-low-power 32-bit MCU ARM-based Cortex-M0, up to 192KB Flash, 20KB SRAM, 6KB EEPROM, LCD, USB, ADC, DACs, AES
PDF  139 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L083VB Datenblatt(HTML) 11 Page - STMicroelectronics

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STM32L083xx
Description
36
2.1
Device overview
Table 2. Ultra-low-power STM32L083xxx device features and peripheral counts
Peripheral
STM32L083
V8
STM32L083
CB
STM32L083
VB
STM32L083
RB
STM32L083
CZ
STM32L083
VZ
STM32L083
RZ
Flash memory (Kbytes)
64 Kbytes
128 Kbytes
192 Kbytes
Data EEPROM (Kbytes)
3 Kbytes
6 Kbytes
RAM (Kbytes)
20 Kbytes
AES
1
Timers
General-
purpose
4
Basic
2
LPTIMER
1
RTC/SYSTICK/IWDG/WWDG
1/1/1/1
Commu-
nication
interfaces
SPI/I2S
6(4)(1)/1
I2C
3
USART
4
LPUART
1
USB/(VDD_USB)
1/(1)
GPIOs
84
40
84
51
40
84
51
Clocks:
HSE/LSE/HSI/MSI/LSI
1/1/1/1/1
12-bit synchronized ADC
Number of channels
1
16
1
10
1
16
1
10
1
16
12-bit DAC
Number of channels
2
2
LCD
COM x SEG
1
4x52 or
8x48
1
4x18
1
4x52 or
8x48
1
4x32 or 8x28
1
4x18
1
4x52 or
8x48
1
4x32 or
8x28(2)
Comparators
2
Capacitive sensing
channels
24
17
24
24
17
24
24
Max. CPU frequency
32 MHz
Operating voltage
1.8 V to 3.6 V (down to 1.65 V at power-down) with BOR option 1.65 to 3.6 V without BOR option
Operating temperatures
Ambient temperature: –40 to +125 °C
Junction temperature: –40 to +130 °C
Packages
LQFP100
UFBGA100
LQFP48
LQFP100
UFBGA100
LQFP64
LQFP48
LQFP100
UFBGA100
LQFP64
TFBGA64
1. 4 SPI interfaces are USARTs operating in SPI master mode.
2. On TFBGA64, only 4x31 or 8x27 COMxSEG are available.



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