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FOOTPRINT-SOD80C Datenblatt(PDF) 1 Page - NXP Semiconductors |
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FOOTPRINT-SOD80C Datenblatt(HTML) 1 Page - NXP Semiconductors |
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1 / 1 page ![]() PDF: 2003 Jan 09 Philips Semiconductors PC board footprint SOD80C FOOTPRINT (REFLOW SOLDERING) handbook, full pagewidth MSA435 2.30 4.30 4.55 1.60 1.70 2.25 0.90 (2x) solder lands solder resist occupied area solder paste Dimensions in mm. SOD80C FOOTPRINT (WAVE SOLDERING) handbook, full pagewidth MSA461 ,, ,, ,, ,, 2.70 4.90 6.30 1.70 2.90 ,, ,, ,, ,, solder lands solder resist occupied area 1.90 tracks Dimensions in mm. |
Ähnliche Beschreibung - FOOTPRINT-SOD80C |
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