HTS221 datasheet(13/33 Pages) STMICROELECTRONICS

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HTS221

Application hints

Figure 5. HTS221 electrical connections

The device is supplied through the VDD line. The power supply decoupling capacitor (100 nF

ceramic) should be placed as near as possible to the supply pad of the device (common

design practice).

The functionality of the device and the measured data outputs are selectable and accessible

through the I²C/SPI interfaces. To select the I²C interface, the CS line must be tied high (i.e.

connected to VDD) or left unconnected (thanks to the internal pull-up).

All the voltage and ground supplies must be present at the same time to have proper

behavior of the IC (refer to Figure 5).

4.1

Soldering information

The HLGA package is compliant with the ECOPACK® standard and it is qualified for

soldering heat resistance according to JEDEC J-STD-020. After soldering, the accuracy

specification of the sensor can be guaranteed after re-hydration of the sensor element in a

stabilized environment (25 °C / 55% rH) for 3 days or at 70% rH for 12 h. Otherwise the

sensor may read an offset that slowly disappears if exposed to ambient conditions.

HTS221 Datenblatt(PDF) 13 Page - STMicroelectronics