USB224X datasheet(34/43 Pages) MICROCHIP

34 / 43 page

USB224X

DS00001979A-page 34

 2010 - 2015 Microchip Technology Inc.

Note 9-4

Output leakage is measured with the current pins in high impedance.

Note 9-5

See The USB 2.0 Specification, Chapter 7, for USB DC electrical characteristics

Note 9-6

RBIAS is a 3.3 V tolerant analog pin.

Note 9-7

Output current range is controlled by program software, software disables FET during short circuit

condition.

Note 9-8

The assignment of each Integrated Card Power FET to a designated Card Connector is controlled

by both firmware and the specific board implementation.

Note 9-9

The 3.3 V supply should be at least at 75% of its operating condition before the 1.8 V supply is

allowed to ramp up.

9.4

Capacitance

TA = 25°C; fc = 1 MHz; VDD, VDDP = 1.8 V

9.5

Package Thermal Specification

Note 9-10

Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal

vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the

ambient air.

TABLE 9-1:

PIN CAPACITANCE

Parameter

Symbol

Limits

Unit

Test Condition

MIN

TYP

MAX

Clock Input Capacitance

CXTAL

All pins (except USB pins and

pins under test) are tied to AC

ground.

Input Capacitance

CIN

Output Capacitance

COUT

TABLE 9-2:

36-PIN QFN PACKAGE THERMAL PARAMETERS

Parameter

Velocity

(Meters/Sec)

Symbol

Value

Unit

Thermal Resistance

33.2

°C/W

129

226

Junction-to-Top-of-Package

2.6

°C/W

12.6

22.6

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