TP5510WM datasheet(11/12 Pages) NSC

11 / 12 page

Applications Information

POWER SUPPLIES

While the pins of the AFE are well protected against electri-

cal misuse it is recommended but not mandatory that the

standard CMOS practice be followed ensuring that ground

is connected to the device before any other connections are

made In applications where the printed circuit board may be

plugged into a ‘‘hot’’ socket with power and clocks already

present an extra long ground pin in the connector should

be used

All ground connections to each device should meet at a

common point as close as possible to the GNDA pin This

minimizes the interaction of ground return currents flowing

through a common bus impedance 01 mF supply decou-

pling capacitors should be connected from this common

ground point to VCC and VBB as close to the device as

possible

For best performance if more than 1 AFE is on a card the

ground point of each AFE on a card should be connected to

a common card ground in star formation rather than via a

ground bus

This common ground point should be decoupled to VCC and

VBB with 10 mF capacitors

Physical Dimensions inches (millimeters) unless otherwise noted

Molded Small Outline Package (WM)

Order Number TP5510WM

NS Package Number M16B

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TP5510WM Datenblatt(PDF) 11 Page - National Semiconductor (TI)