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USB3250 Datenblatt(PDF) 9 Page - Microchip Technology

Teilenummer USB3250
Bauteilbeschribung  Hi-Speed USB Device Transceiver with UTMI Interface
PDF  46 Pages
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Hersteller  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

USB3250 Datenblatt(HTML) 9 Page - Microchip Technology

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2013 - 2016 Microchip Technology Inc.
DS00002142A-page 9
USB3250
Note 4-1
A Ferrite Bead (with DC resistance <.5 Ohms) is recommended for filtering between both the VDD3.3
and VDDA3.3 supplies and the VDD1.8 and VDDA1.8 Supplies. See FIGURE 8-9: Application
Diagram for 56-pin VQFN Package on page 39.
Note 4-2
All VSS and VSSA are bonded to the exposed pad under the IC in the package. The exposed pad
must be connected to solid GND plane on printed circuit board.
TABLE 4-3:
USB I/O SIGNALS
Name
Direction
Active Level
Description
DP
I/O
N/A
USB Positive Data Pin.
DM
I/O
N/A
USB Negative Data Pin.
TABLE 4-4:
BIASING AND CLOCK OSCILLATOR SIGNALS
Name
Direction
Active Level
Description
RBIAS
Input
N/A
External 1% bias resistor. Requires a 12K
 resistor to ground.
Used for setting HS transmit current level and on-chip termination
impedance.
XI/XO
Input
N/A
External crystal. 12MHz crystal connected from XI to XO.
TABLE 4-5:
POWER AND GROUND SIGNALS
Name
Direction
Active Level
Description
VDD3.3
N/A
N/A
3.3V Digital Supply. Powers digital pads. See Note 4-1
VDD1.8
N/A
N/A
1.8V Digital Supply. Powers digital core.
VSS
N/A
N/A
Digital Ground. See Note 4-2
VDDA3.3
N/A
N/A
3.3V Analog Supply. Powers analog I/O and 3.3V analog circuitry.
VDDA1.8
N/A
N/A
1.8V Analog Supply. Powers 1.8V analog circuitry. See Note 4-1
VSSA
N/A
N/A
Analog Ground. See Note 4-2



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