 2015 Microchip Technology Inc.

DS20005384A-page 11

LR645

3-Lead TO-220 Package Outline (N5)

Symbol

A

A1

A2

b

b2

c

D

D1

D2

E

E1

E2

e

H1

L

L1

Q

P

Dimen-

sion

(inches)

MIN

.140

.020

.080

.015

.045

.560

.380

.270

0.20*

.100

BSC

.230

.500

.200*

.100

.139

NOM

-

-

-

.027

.057

-

-

-

-

-

-

-

-

-

-

-

-

MAX

.190

.055

.040

.070

.024

.650

.507

.420

.350

.030

.270

.580

.250

.135

.161

JEDEC Registration TO-220, Variation AB, Issue K, April 2002.

Drawings not to scale.

L

A2

A

e

View

B

12

3

D

D1

Q

4

E2

E

ΦP

Seating

Plane

A1

A

A

Chamfer

Optional

H1

E

D2

Thermal

Pad

Front View

Side View

View A - A

L1

b

b2

1

2

3

E1

View B

c

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.