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HD3SS460

SLLSEM7D – JANUARY 2015 – REVISED JANUARY 2017

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Copyright © 2015–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage, VCC

–0.5

4

V

Differential High Speed I/O Voltages, C[R/T]X[1/2][p/n], Ln[A-D][p/n], SS[R/T]X[p/n]

–0.5

2.5

V

Low Speed I/O Voltages, CSBU[1/2], SBU[1/2]

–0.5

4

V

Control signal voltages, POL, AMSEL, EN

–0.5

4

V

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±4000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

V

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2.7

3.3

3.6

V

Operating free air temperature

HD3SS460

0

25

70

°C

HD3SS460I

–40

25

85

High speed port common mode voltage

0

2

V

Low Speed signal voltage

0

VCC

Vdiff

High speed port differential voltage

0

1.8

Vpp

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

HD3SS460

UNIT

QFN (RNH)

QFN (RHR)

30 PINS

28 PINS

Junction-to-ambient thermal resistance

51.6

44.0

°C/W

Junction-to-case (top) thermal resistance

37.5

34.8

°C/W

Junction-to-board thermal resistance

17.5

14.7

°C/W

Junction-to-top characterization parameter

0.7

0.7

°C/W

Junction-to-board characterization parameter

17.3

24.5

°C/W

Junction-to-case (bottom) thermal resistance

6.8

6.9

°C/W