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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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ADL5567ACPZN-R7 Datenblatt(PDF) 20 Page - Analog Devices |
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ADL5567ACPZN-R7 Datenblatt(HTML) 20 Page - Analog Devices |
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20 / 24 page  Data Sheet ADL5567 Rev. 0 | Page 19 of 23 Table 6. Example RC Values for Various Bandwidth Limits Component Value/Device Description/Comments Amplifier ½ ADL5567 One channel RSERIES 10 Ω Small value to minimize loss Wideband Configuration BW 3 GHz Wide BW allows undersampling operation CFILTER (See Figure 51) 1 pF Final value depends on PCB parasitics Nyquist Band Configuration BW 1.8 GHz Filters noise and harmonics above Nyquist frequency CFILTER (See Figure 51) 2.2 pF Final value depends on PCB parasitics ADC AD9625 2.6 GSPS, 12-bit ADC AVDD –2V PAD ADL5567 MINI-CIRCUITS Bias-TEE ZFBT-4R2GW DC OFFSET: 550mV AVDD –2V AVDD 3.3V AVDD DRVDD 20Ω 10kΩ VCOM VIP PM VIN AVDD 3.3V AVDD M2V 10kΩ 95Ω 100Ω 0.75pF ADC INTERNAL INPUT Z AD9625 VCM 51Ω 10Ω 10Ω 20Ω 20Ω 0.1µF CFILTER 1pF CFILTER 1pF ANALOG INPUT INPUT Z = 50Ω 1µF Figure 51. Wideband ADC Interfacing Example: ADL5567 Driving the AD9625 50Ω ANALYZER 84.5Ω 84.5Ω ETC1-1 0.1µF 0.1µF 34.8Ω 34.8Ω VIN1 VIP1 AC 50Ω 0.1µF 0.1µF ETC1-1 VS 5nH 0.1µF ADL5567 AMPLIFIER 1 50Ω 50Ω Figure 52. General-Purpose Characterization Circuit SOLDERING INFORMATION AND RECOMMENDED LAND PATTERN Figure 53 shows the recommended land pattern for the ADL5567. The ADL5567 is contained in a 4 mm × 4 mm LFCSP package, which has an exposed ground pad (EP). This pad is internally connected to the ground of the chip. To minimize thermal impedance and ensure electrical performance, solder the pad to the low impedance ground plane on the PCB. To further reduce thermal impedance, it is recommended that the ground planes on all layers under the paddle be stitched together with vias. For more information on land pattern design and layout, refer to the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). The land pattern on the ADL5567 evaluation board provides a simulated thermal resistance (θJA) of 56 °C/W. 13 MILS 39 MILS 12 MILS 91 MILS 13.7 MILS 19.7 MILS Figure 53. Recommended Land Pattern |
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