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LM4850MM Datenblatt(PDF) 6 Page - National Semiconductor (TI) |
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LM4850MM Datenblatt(HTML) 6 Page - National Semiconductor (TI) |
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6 / 20 page ![]() Typical Performance Characteristics LD Specific Characteristics (Continued) LM4850LD Power Dissipation vs Output Power LM4850LD (Note 13) Power Derating Curve 20001079 20001094 Note 13: This curve shows the LM4850LD’s thermal dissipation ability at different ambient temperatures given the exposed-DAP of the part is soldered to a plane of 1oz. Cu with an area given in the label of each curve. This label also designated whether the plane exists on the same (top) layer as the chip, on the bottom layer, or on both layers. Infinite heatsink and unattached (no heatsink) conditions are also shown. Typical Performance Characteristics Non-LD Specific Characteristics THD+N vs Frequency THD+N vs Frequency 20001063 20001064 THD+N vs Frequency THD+N vs Frequency 20001065 20001066 www.national.com 6 |
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