HMIC™ Silicon PIN Diode Switches

Rev. V11

MA4SWx10 Series

7

7

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7

MA4SW110

INCHES

MM

DIM

MIN.

MAX.

MIN.

MAX.

A

0.014

0.018

0.35

0.45

B

0.025

0.029

0.64

0.74

C

0.008 Ref.

0.20 Ref.

D

0.004

0.006

0.10

0.15

E

0.004 Ref.

0.10 Ref.

F

0.003 Ref.

0.08 Ref.

G

0.003 Ref.

0.08 Ref.

H

0.020 Ref.

0.52 Ref.

7. Topside and backside metallization is gold, 2.5 µm thick typical.

8. Yellow areas indicate ribbon/wire bonding pads

DIM

INCHES

MM

MIN.

MAX.

MIN.

MAX.

A

0.029

0.033

0.73

0.83

B

0.004

0.006

0.10

0.15

C

0.004 Ref.

0.10 Ref.

D

0.005 Ref.

0.13 Ref.

E

0.009 Ref.

0.23 Ref.

F

0.023 Ref.

0.58 Ref.

G

0.007 Ref.

0.17 Ref.

H

0.004 Ref.

0.10 Ref.

DIM

INCHES

MM

MIN.

MAX.

MIN.

MAX.

A

0.046

0.050

1.16

1.26

B

0.036

0.040

0.92

1.02

C

0.019 Ref.

0.48 Ref.

D

0.014 Ref.

0.36 Ref.

E

0.004 Ref.

0.10 Ref.

F

0.005 Ref.

0.13 Ref.

G

0.004

0.10

0.006

0.15

H

0.005 Ref.

0.12 Ref.

J

0.004 Ref.

0.10 Ref.

MA4SW210

MA4SW310