2

IR2101/IR21014/IR2102/IR21024

Symbol

Definition

Min.

Max.

Units

High side floating supply voltage

-0.3

625

High side floating supply offset voltage

High side floating output voltage

Low side and logic fixed supply voltage

-0.3

25

Low side output voltage

-0.3

Logic input voltage (HIN & LIN)

-0.3

Allowable offset supply voltage transient

—

50

V/ns

(8 lead PDIP)

—

1.0

(8 lead SOIC)

—

0.625

(14 lead PDIP)

—

1.6

(14 lead SOIC)

—

1.0

Thermal resistance, junction to ambient

(8 lead PDIP)

—

125

(8 lead SOIC)

—

200

(14 lead PDIP)

—

75

(14 lead SOIC)

—

120

Junction temperature

—

150

Storage temperature

-55

150

Lead temperature (soldering, 10 seconds)

—

300

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-

eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured

under board mounted and still air conditions.

W

°C/W

V

Symbol

Definition

Min.

Max.

Units

High side floating supply absolute voltage

High side floating supply offset voltage

Note 1

600

High side floating output voltage

Low side and logic fixed supply voltage

10

20

Low side output voltage

0

Logic input voltage (HIN & LIN) (IR2101) & (HIN & LIN) (IR2102)

0

Ambient temperature

-40

125

Recommended Operating Conditions

The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the

°C

V

°C