If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage

6.0V

Storage Temperature

−65˚C to +150˚C

Input Voltage

−0.3V to V

Power Dissipation (Note 4)

Internally limited

ESD Susceptibility (Note 5)

3500V

ESD Susceptibility (Note 6)

250V

Junction Temperature

150˚C

Soldering Information (Note 1)

Small Outline Package

Vapor Phase (60 seconds)

215˚C

Infrared (15 seconds)

220˚C

Thermal Resistance

θ

56˚C/W

θ

210˚C/W

θ

35˚C/W

θ

170˚C/W

θ

37˚C/W

θ

107˚C/W

Operating Ratings

Temperature Range

T

−40˚C

≤ T

Supply Voltage

2.7V

≤ V

Note 1: See AN-450 “Surface Mounting and their Effects on Product Reli-

ability” for other methods of soldering surface mount devices.

The following specifications apply for V

Symbol

Parameter

Conditions

LM4881

Units (Limits)

Typ (Note 7)

Limit (Note 8)

V

DD

Power Supply Voltage

2.7

V (min)

5.5

V (max)

I

DD

Quiescent Current

V

3.6

6.0

mA (max)

I

SD

Shutdown Current

V

0.7

5

µA (max)

V

OS

Offset Voltage

V

5

50

mV (max)

P

O

Output Power

THD = 0.1% (max);f=1 kHz;

R

200

125

mW (min)

R

150

mW

R

85

mW

THD+N=10%;f=1 kHz;

R

300

mW

R

200

mW

R

110

mW

THD+N

Total Harmonic Distortion +

Noise

R

0.025

%

R

f=1kHz

0.02

%

PSRR

C

mVrms, f = 120Hz

50

dB

www.national.com

2